Bond It TS550 WOOD FLOOR ADHESIVE Buff 10L
A permanently flexible, one part, ready to use, moisture cure, internal wood flooring adhesive. Free from silicone, solvent, isocyanates and water. Based on Hybrid Polymer Technology; the TS range reduces the risk of warping or deforming the wood flooring due to its moisture and solvent-free composition.
- Solvent and moisture-free.
- Permanently elastic.
- Based on hybrid polymer technology.
- Suitable for use with parquet, mosaic, oak, woodblock and laminated exotic timber and many other wood types.
- Can be used with underfloor heating systems.
- Reduces the risk of warping and deforming.
- Quick cure and rapid bond strength.
- Excellent gap-filling properties.
- Acoustic properties.
- Special nozzle to extrude triangular shaped bead in cartridge format.
For internal bonding of parquet, mosaic oak, woodblock, laminated, exotic timber and many other wood floor types to porous or non-porous substrates including; screeds, chipboard, plywood, concrete and anhydrite. Also compatible with substrates incorporating underfloor heating systems. Now available in 600ml sausage versions.
All surfaces must clean, dry and free from, grease, polish, old adhesive remnants or any other contaminants that may hinder adhesion. Loose, friable or cracked areas should be repaired prior to application. The moisture content throughout the substrate should be checked by Hygrometer, ensuring that the moisture content does not exceed
that recommended by the wood flooring manufacturer for the particular substrate. In particular, Anhydrite levels would differ to those of concrete. The wood flooring should also be checked that the relative humidity figure falls within those recommended by the manufacturer. Note; underfloor heating systems should be turned off 48 hours
before and 48 hours after application.
How To Use
The application temperature should not be below +10C and not above +30C, materials should be acclimatised to this temperature in the intended application site prior to installation. Solid floors should have an existing DPM in place.
Using a suitably sized notched trowel, apply the adhesive to the substrate. Do not apply more adhesive than will be used within 20 minutes of application. To ensure maximum transfer of adhesive to the wood, lay into the adhesive with a slight twisting motion and tap into place. Loading the flooring with weights will ensure the 80% minimum
coverage required is achieved and will improve the final bond strength.
TS550 will take at least 24 hours to cure assuming a temperature of 23C at 50% RH. Cooler and/or less humid conditions will extend drying times. Wait until the adhesive has fully cured before sanding or finishing the flooring.
Uncured TS550 can be removed by white spirit. Cured adhesive must be removed mechanically.